Einordnung

Konferenz:

2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Delft, Netherlands, 28 August 2022 - 02 September 2022

Datum der Veröffentlichung:

30.03.2023

URN:

urn:nbn:de:hbz:465-20230330-163358-3

DOI:

10.1109/IRMMW-THz50927.2022.9895647

Sprache:

Englisch

Ressourcentyp:

Text

Kollektion:

E-Publikationen

Sachgruppen der Deutschen Nationalbibliographie:

620 Ingenieurwissenschaften und Maschinenbau

Einrichtung:

Fakultät für Ingenieurwissenschaften, Elektrotechnik und Informationstechnik, Optoelektronik

Versionskennzeichen:

Authors Accepted Manuscript / Postprint

Förderung:

Funding Agency: 10.13039/501100000783-Research Executive Agency

Informationen zur Erstveröffentlichung:

This is the authors version of:
S. Iwamatsu, M. Ali, J. L. Fernandez-Estevez, S. Makhlouf, G. Carpintero and A. Stöhr, "Broadband THz Interconnect for Hybrid Integration of InP and Si Platforms," in: 2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Delft, Netherlands, 2022. doi: 10.1109/IRMMW-THz50927.2022.9895647.

Date Added to IEEE Xplore: 26 September 2022

Changes were made to this version by the publisher prior to publication. The final version of record was published by IEEE and is available at https://doi.org/10.1109/IRMMW-THz50927.2022.9895647

Restriktion:

Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.