Broadband THz Interconnect for Hybrid Integration of InP and Si Platforms

ORCID
0000-0001-6394-1367
LSF
61911
Affiliation
University of Duisburg-Essen, ZHO, Lotharstr. 55, 47057 Duisburg, Germany
Iwamatsu, Shuya;
Affiliation
Universidad Carlos III de Madrid, Avenida de la Universidad 30, 28911 Leganés, Madrid, Spain
Ali, Muhsin;
Affiliation
University of Duisburg-Essen, ZHO, Lotharstr. 55, 47057 Duisburg, Germany
Fernandez-Estevez, José Luis;
ORCID
0000-0002-6138-0292
LSF
61347
Affiliation
University of Duisburg-Essen, ZHO, Lotharstr. 55, 47057 Duisburg, Germany
Makhlouf, Sumer;
Affiliation
Universidad Carlos III de Madrid, Avenida de la Universidad 30, 28911 Leganés, Madrid, Spain
Carpintero, Guillermo;
GND
103673627X
ORCID
0000-0003-1036-2120
LSF
2648
Affiliation
University of Duisburg-Essen, ZHO, Lotharstr. 55, 47057 Duisburg, Germany
Stöhr, Andreas

We demonstrate a broadband terahertz coupling between InP-based coplanar waveguide and silicon dielectric rod waveguide for hybrid integration. A coupling efficiency of around −2 dB has been experimentally achieved in frequency range between 70-120 GHz. Numerical simulations reveal an operational 3dB-bandwidth >100 GHz.

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